Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7906425 | Fluxless bumping process | Chia-Fu Lin, Hsin-Hui Lee, Yen-Ming Chen, Kai-Ming Ching, Li-Chih Chen +2 more | 2011-03-15 |
| 7892962 | Nail-shaped pillar for wafer-level chip-scale packaging | — | 2011-02-22 |