Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8049323 | Chip holder with wafer level redistribution layer | Chen-Shien Chen, Chao-Hsiang Yang, Jimmy Liang, Han-Liang Tseng, Tjandra Winata Karta +1 more | 2011-11-01 |
| 8039315 | Thermally enhanced wafer level package | Hsin-Hui Lee, Chien-Hsiun Lee | 2011-10-18 |
| 7952167 | Scribe line layout design | Hsin-Hui Lee, Shin-Puu Jeng, Shang-Yun Hou | 2011-05-31 |