Issued Patents 2011
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8058082 | Light-emitting diode with textured substrate | Chen-Hua Yu, Ding-Yuan Chen, Chia-Lin Yu, Hung-Ta Lin | 2011-11-15 |
| 8058669 | Light-emitting diode integration scheme | Ding-Yuan Chen, Chen-Hua Yu | 2011-11-15 |
| 8058150 | Particle free wafer separation | Weng-Jin Wu, Ku-Feng Yang, Jung-Chih Hu, Chen-Hua Yu | 2011-11-15 |
| 8053277 | Three-dimensional integrated circuits with protection layers | Chen-Hua Yu, Weng-Jin Wu, Hung-Jung Tu, Ku-Feng Yang | 2011-11-08 |
| 8053900 | Through-substrate vias (TSVs) electrically connected to a bond pad design with reduced dishing effect | Chen-Hua Yu, Weng-Jin Wu | 2011-11-08 |
| 8044409 | III-nitride based semiconductor structure with multiple conductive tunneling layer | Chia-Lin Yu, Ding-Yuan Chen, Chen-Hua Yu | 2011-10-25 |
| 8021566 | Method for pre-conditioning CMP polishing pad | Chia-Che Chuang, Hsin-Hsien Lu, Liang-Guang Chen | 2011-09-20 |
| 7989318 | Method for stacking semiconductor dies | Ku-Feng Yang, Weng-Jin Wu, Chen-Hua Yu | 2011-08-02 |
| 7972969 | Method and apparatus for thinning a substrate | Ku-Feng Yang, Weng-Jin Wu, Kewei Zuo | 2011-07-05 |
| 7960290 | Method of fabricating a semiconductor device | Chen-Hua Yu, Weng-Jin Wu | 2011-06-14 |
| 7956448 | Stacked structures and methods of fabricating stacked structures | Chen-Hua Yu, Weng-Jin Wu, Jean Wang | 2011-06-07 |
| 7955895 | Structure and method for stacked wafer fabrication | Ku-Feng Yang, Weng-Jin Wu, Hung-Jung Tu | 2011-06-07 |
| 7951647 | Performing die-to-wafer stacking by filling gaps between dies | Ku-Feng Yang, Weng-Jin Wu, Ming-Chung Sung | 2011-05-31 |
| 7943421 | Component stacking using pre-formed adhesive films | Weng-Jin Wu, Hung-Jung Tu, Ku-Feng Yang, Jung-Chih Hu | 2011-05-17 |
| 7939941 | Formation of through via before contact processing | Chen-Hua Yu, Weng-Jin Wu | 2011-05-10 |
| 7897481 | High throughput die-to-wafer bonding using pre-alignment | Weng-Jin Wu, Chen-Hua Yu | 2011-03-01 |
| 7888236 | Semiconductor device and fabrication methods thereof | Han-Ping Pu, Bai-Yao Lou, Dean Wang, Ching-Wen Hsiao, Kai-Ming Ching +3 more | 2011-02-15 |
| 7883991 | Temporary carrier bonding and detaching processes | Wen-Jin Wu, Shau-Lin Shue | 2011-02-08 |
| 7879711 | Stacked structures and methods of fabricating stacked structures | Chen-Hua Yu, Weng-Jin Wu, Jean Wang | 2011-02-01 |
| 7875534 | Realizing N-face III-nitride semiconductors by nitridation treatment | Chen-Hua Yu, Chia-Lin Yu, Ding-Yuan Chen | 2011-01-25 |
| 7872357 | Protection for bonding pads and methods of formation | Chen-Hua Yu, Weng-Jin Wu | 2011-01-18 |