Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8053277 | Three-dimensional integrated circuits with protection layers | Chen-Hua Yu, Wen-Chih Chiou, Weng-Jin Wu, Ku-Feng Yang | 2011-11-08 |
| 7955895 | Structure and method for stacked wafer fabrication | Ku-Feng Yang, Wen-Chih Chiou, Weng-Jin Wu | 2011-06-07 |
| 7943421 | Component stacking using pre-formed adhesive films | Weng-Jin Wu, Ku-Feng Yang, Jung-Chih Hu, Wen-Chih Chiou | 2011-05-17 |