Issued Patents 2011
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8058150 | Particle free wafer separation | Ku-Feng Yang, Jung-Chih Hu, Wen-Chih Chiou, Chen-Hua Yu | 2011-11-15 |
| 8053900 | Through-substrate vias (TSVs) electrically connected to a bond pad design with reduced dishing effect | Chen-Hua Yu, Wen-Chih Chiou | 2011-11-08 |
| 8053277 | Three-dimensional integrated circuits with protection layers | Chen-Hua Yu, Wen-Chih Chiou, Hung-Jung Tu, Ku-Feng Yang | 2011-11-08 |
| 7989318 | Method for stacking semiconductor dies | Ku-Feng Yang, Wen-Chih Chiou, Chen-Hua Yu | 2011-08-02 |
| 7972969 | Method and apparatus for thinning a substrate | Ku-Feng Yang, Wen-Chih Chiou, Kewei Zuo | 2011-07-05 |
| 7960290 | Method of fabricating a semiconductor device | Chen-Hua Yu, Wen-Chih Chiou | 2011-06-14 |
| 7955895 | Structure and method for stacked wafer fabrication | Ku-Feng Yang, Wen-Chih Chiou, Hung-Jung Tu | 2011-06-07 |
| 7956448 | Stacked structures and methods of fabricating stacked structures | Chen-Hua Yu, Wen-Chih Chiou, Jean Wang | 2011-06-07 |
| 7951647 | Performing die-to-wafer stacking by filling gaps between dies | Ku-Feng Yang, Wen-Chih Chiou, Ming-Chung Sung | 2011-05-31 |
| 7951723 | Integrated etch and supercritical CO2 process and chamber design | Ching-Ya Wang, Henry Lo, Jean Wang | 2011-05-31 |
| 7943421 | Component stacking using pre-formed adhesive films | Hung-Jung Tu, Ku-Feng Yang, Jung-Chih Hu, Wen-Chih Chiou | 2011-05-17 |
| 7939941 | Formation of through via before contact processing | Wen-Chih Chiou, Chen-Hua Yu | 2011-05-10 |
| 7897481 | High throughput die-to-wafer bonding using pre-alignment | Wen-Chih Chiou, Chen-Hua Yu | 2011-03-01 |
| 7879711 | Stacked structures and methods of fabricating stacked structures | Chen-Hua Yu, Wen-Chih Chiou, Jean Wang | 2011-02-01 |
| 7872357 | Protection for bonding pads and methods of formation | Chen-Hua Yu, Wen-Chih Chiou | 2011-01-18 |