Issued Patents 2011
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8058100 | Method for fabricating chip scale package structure with metal pads exposed from an encapsulant | Chien-Ping Huang, Cheng-Hsu Hsiao | 2011-11-15 |
| 7993967 | Semiconductor package fabrication method | Yih-Jenn Jiang, Chien-Ping Huang, Cheng-Hsu Hsiao | 2011-08-09 |
| 7932601 | Enhanced copper posts for wafer level chip scale packaging | Kuo-Chin Chang, Pei-Haw Tsao | 2011-04-26 |
| 7888236 | Semiconductor device and fabrication methods thereof | Bai-Yao Lou, Dean Wang, Ching-Wen Hsiao, Kai-Ming Ching, Chen-Cheng Kuo +3 more | 2011-02-15 |
| 7871860 | Method of semiconductor packaging | Tsung-Shu Lin, Chen-Shien Chen | 2011-01-18 |