Issued Patents 2011
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8062933 | Method for fabricating heat dissipating package structure | Chien-Ping Huang | 2011-11-22 |
| 8058100 | Method for fabricating chip scale package structure with metal pads exposed from an encapsulant | Han-Ping Pu, Chien-Ping Huang | 2011-11-15 |
| 8013436 | Heat dissipation package structure and method for fabricating the same | Min-Shun Hung, Yo-Yi Tsai, Chien-Ping Huang | 2011-09-06 |
| 8008769 | Heat-dissipating semiconductor package structure and method for manufacturing the same | Wen-Tsung Tseng, Ho-Yi Tsai, Chien-Ping Huang | 2011-08-30 |
| 7993967 | Semiconductor package fabrication method | Yih-Jenn Jiang, Han-Ping Pu, Chien-Ping Huang | 2011-08-09 |
| 7981729 | Fabrication method of multi-chip stack structure | Jung-Pin Huang, Chin-Huang Chang, Chien-Ping Huang, Chung-Lun Liu | 2011-07-19 |