Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8008769 | Heat-dissipating semiconductor package structure and method for manufacturing the same | Ho-Yi Tsai, Chien-Ping Huang, Cheng-Hsu Hsiao | 2011-08-30 |
| 7889511 | Electronic carrier board applicable to surface mount technology | Fang-Lin Tsai, Ho-Yi Tsai, Chih-Ming Huang | 2011-02-15 |