Issued Patents 2011
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8049327 | Through-silicon via with scalloped sidewalls | Chih-Hua Chen, Ming-Fa Chen, Chen-Shien Chen | 2011-11-01 |
| 8034708 | Structure and process for the formation of TSVs | Kai-Ming Ching, Chen-Shien Chen | 2011-10-11 |
| 7973413 | Through-substrate via for semiconductor device | Chen Chen-Shien, Kai-Ming Ching, Chih-Hua Chen | 2011-07-05 |
| 7969013 | Through silicon via with dummy structure and method for forming the same | Chih-Hua Chen, Chen-Shien Chen, Wen-Wei Shen | 2011-06-28 |
| 7919406 | Structure and method for forming pillar bump structure having sidewall protection | Ming Hung Tseng, Young-Chang Lien, Chen-Shien Chen | 2011-04-05 |
| 7888236 | Semiconductor device and fabrication methods thereof | Han-Ping Pu, Bai-Yao Lou, Dean Wang, Ching-Wen Hsiao, Kai-Ming Ching +3 more | 2011-02-15 |