Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8048778 | Methods of dicing a semiconductor structure | Chin-Yu Ku, Hsiu-Mei Yu, Chun-Ying Lin, Sheng-Hsiang Chiu, Ta-Jen Yu | 2011-11-01 |
| 7919406 | Structure and method for forming pillar bump structure having sidewall protection | Ming Hung Tseng, Chen-Shien Chen, Chen-Cheng Kuo | 2011-04-05 |