Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8048778 | Methods of dicing a semiconductor structure | Chin-Yu Ku, Hsiu-Mei Yu, Young-Chang Lien, Sheng-Hsiang Chiu, Ta-Jen Yu | 2011-11-01 |
| 7932531 | Chip package | Ya-Chi Chen, Yu-Ren Chen, I-Hsin Mao | 2011-04-26 |
| 7902649 | Leadframe for leadless package, structure and manufacturing method using the same | Geng-Shin Shen, Yu-Tang Pan, Shih-Wen Chou | 2011-03-08 |