Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| RE42349 | Wafer treating method for making adhesive dies | Chun-Hung Lin, Jesse Huang, Kuang-Hui Chen | 2011-05-10 |
| 7919874 | Chip package without core and stacked chip package structure | Yu-Tang Pan, Cheng-Ting Wu, Hui Liu | 2011-04-05 |
| 7902649 | Leadframe for leadless package, structure and manufacturing method using the same | Chun-Ying Lin, Geng-Shin Shen, Yu-Tang Pan | 2011-03-08 |
| 7884486 | Chip-stacked package structure and method for manufacturing the same | Yu-Tang Pan | 2011-02-08 |