Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7919874 | Chip package without core and stacked chip package structure | Cheng-Ting Wu, Shih-Wen Chou, Hui Liu | 2011-04-05 |
| 7902649 | Leadframe for leadless package, structure and manufacturing method using the same | Chun-Ying Lin, Geng-Shin Shen, Shih-Wen Chou | 2011-03-08 |
| 7884486 | Chip-stacked package structure and method for manufacturing the same | Shih-Wen Chou | 2011-02-08 |