Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8026615 | IC package reducing wiring layers on substrate and its carrier | Hung-Tsun Lin, Wu-Chang Tu | 2011-09-27 |
| 7939950 | Chip package structure | I-Cheng Lu, Yu-Cheng Chang, Tsu-Ting Wang | 2011-05-10 |
| 7919874 | Chip package without core and stacked chip package structure | Yu-Tang Pan, Shih-Wen Chou, Hui Liu | 2011-04-05 |
| 7885357 | Apparatus for signal detection to enhance performance of a receiver and method therefor | Chia-Wei Kuo | 2011-02-08 |