Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8026615 | IC package reducing wiring layers on substrate and its carrier | Wu-Chang Tu, Cheng-Ting Wu | 2011-09-27 |
| 7952198 | BGA package with leads on chip | — | 2011-05-31 |
| 7879653 | Leadless semiconductor package with electroplated layer embedded in encapsulant and the method for manufacturing the same | — | 2011-02-01 |