Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8026615 | IC package reducing wiring layers on substrate and its carrier | Hung-Tsun Lin, Cheng-Ting Wu | 2011-09-27 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8026615 | IC package reducing wiring layers on substrate and its carrier | Hung-Tsun Lin, Cheng-Ting Wu | 2011-09-27 |