Issued Patents 2011
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8058109 | Method for manufacturing a semiconductor structure | — | 2011-11-15 |
| 7981725 | Fabricating process of a chip package structure | David W. Wang | 2011-07-19 |
| 7964940 | Chip package with asymmetric molding | — | 2011-06-21 |
| 7960214 | Chip package | David W. Wang | 2011-06-14 |
| 7927922 | Dice rearrangement package structure using layout process to form a compliant configuration | Yu-Ren Chen | 2011-04-19 |
| 7919358 | Method for fabricating multi-chip stacked package | Yu-Ren Chen | 2011-04-05 |
| 7915690 | Die rearrangement package structure using layout process to form a compliant configuration | — | 2011-03-29 |
| 7902649 | Leadframe for leadless package, structure and manufacturing method using the same | Chun-Ying Lin, Yu-Tang Pan, Shih-Wen Chou | 2011-03-08 |
| 7888783 | Chip package structure and the method thereof with adhering the chips to a frame and forming UBM layers | Yu-Ren Chen | 2011-02-15 |