Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7981725 | Fabricating process of a chip package structure | Geng-Shin Shen | 2011-07-19 |
| 7973310 | Semiconductor package structure and method for manufacturing the same | An-Hong Liu, Hao-Yin Tsai, Hsiang-Ming Huang, Yi-Chang Lee, Shu-Ching Ho | 2011-07-05 |
| 7960214 | Chip package | Geng-Shin Shen | 2011-06-14 |
| 7866708 | Joining tubular members | Craig D. Johnson, Matthew R. Hackworth, Michael Dean Langlais, Laurent Alteirac, Stephane J. Virally +5 more | 2011-01-11 |