Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7973310 | Semiconductor package structure and method for manufacturing the same | David W. Wang, An-Hong Liu, Hao-Yin Tsai, Hsiang-Ming Huang, Yi-Chang Lee | 2011-07-05 |
| 7871592 | Method for preparing a carbon/carbon composite | Jiin-Huey Chern Lin, Chien-Ping Ju, Hua-Hsuan Kuo, Seng-Meng Chen | 2011-01-18 |