Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7932531 | Chip package | Chun-Ying Lin, Ya-Chi Chen, I-Hsin Mao | 2011-04-26 |
| 7927922 | Dice rearrangement package structure using layout process to form a compliant configuration | Geng-Shin Shen | 2011-04-19 |
| 7919358 | Method for fabricating multi-chip stacked package | Geng-Shin Shen | 2011-04-05 |
| 7888783 | Chip package structure and the method thereof with adhering the chips to a frame and forming UBM layers | Geng-Shin Shen | 2011-02-15 |