Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8013425 | Scribe line structure for wafer dicing and method of making the same | Ping-Chang Wu | 2011-09-06 |
| 7871860 | Method of semiconductor packaging | Han-Ping Pu, Chen-Shien Chen | 2011-01-18 |