DY

Daniel Yang

TSMC: 1 patents #282 of 830Top 35%
📍 Baoshan, CA: #10 of 21 inventorsTop 50%
Overall (2011): #318,145 of 364,097Top 90%
1
Patents 2011

Issued Patents 2011

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
7863742 Back end integrated WLCSP structure without aluminum pads Hsiu-Mei Yu, Tjandra Winata Karta, Shih-Ming Chen, Chia-Jen Cheng 2011-01-04