Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8005326 | Optical clock signal distribution using through-silicon vias | Shih-Cheng Chang, Jin-Lien Lin, Kai-Ming Ching, Jiun Yi Wu, Yen-Huei Chen | 2011-08-23 |
| 7956442 | Backside connection to TSVs having redistribution lines | Chen-Shien Chen | 2011-06-07 |
| 7928534 | Bond pad connection to redistribution lines having tapered profiles | Chen-Shien Chen, Hon-Lin Huang | 2011-04-19 |