Issued Patents 2011
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8072076 | Bond pad structures and integrated circuit chip having the same | Shih-Hsun Hsu, Shih-Puu Jeng, Shang-Yun Hou | 2011-12-06 |
| 8030776 | Integrated circuit with protective structure | Chen-Hua Yu, Shin-Puu Jeng, Shang-Yun Hou, Hao-Yi Tsai, Hsiu-Ping Wei | 2011-10-04 |
| 8013333 | Semiconductor test pad structures | Ying-Ju Chen, Yu-Wen Liu, Hao-Yi Tsai, Shin-Puu Jeng | 2011-09-06 |
| 7998855 | Solving via-misalignment issues in interconnect structures having air-gaps | — | 2011-08-16 |
| 7952453 | Structure design for minimizing on-chip interconnect inductance | Hsueh-Chung Chen, Shin-Puu Jeng | 2011-05-31 |
| 7936067 | Backend interconnect scheme with middle dielectric layer having improved strength | Hao-Yi Tsai, Yu-Wen Liu, Ying-Ju Chen, Shin-Puu Jeng | 2011-05-03 |
| 7906836 | Heat spreader structures in scribe lines | Yu-Wen Liu, Jyh-Cherng Sheu, Hao-Yi Tsai, Shin-Puu Jeng, Chen-Hua Yu +1 more | 2011-03-15 |
| 7884473 | Method and structure for increased wire bond density in packages for semiconductor chips | Shih-Hsun Hsu | 2011-02-08 |
| 7868455 | Solving via-misalignment issues in interconnect structures having air-gaps | — | 2011-01-11 |