Issued Patents 2011
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8058151 | Methods of die sawing | Shin-Puu Jeng | 2011-11-15 |
| 8030776 | Integrated circuit with protective structure | Chen-Hua Yu, Shin-Puu Jeng, Shang-Yun Hou, Hsien-Wei Chen, Hsiu-Ping Wei | 2011-10-04 |
| 8013333 | Semiconductor test pad structures | Hsien-Wei Chen, Ying-Ju Chen, Yu-Wen Liu, Shin-Puu Jeng | 2011-09-06 |
| 7936067 | Backend interconnect scheme with middle dielectric layer having improved strength | Yu-Wen Liu, Hsien-Wei Chen, Ying-Ju Chen, Shin-Puu Jeng | 2011-05-03 |
| 7906836 | Heat spreader structures in scribe lines | Hsien-Wei Chen, Yu-Wen Liu, Jyh-Cherng Sheu, Shin-Puu Jeng, Chen-Hua Yu +1 more | 2011-03-15 |