Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8013333 | Semiconductor test pad structures | Hsien-Wei Chen, Ying-Ju Chen, Hao-Yi Tsai, Shin-Puu Jeng | 2011-09-06 |
| 7936067 | Backend interconnect scheme with middle dielectric layer having improved strength | Hao-Yi Tsai, Hsien-Wei Chen, Ying-Ju Chen, Shin-Puu Jeng | 2011-05-03 |
| 7906836 | Heat spreader structures in scribe lines | Hsien-Wei Chen, Jyh-Cherng Sheu, Hao-Yi Tsai, Shin-Puu Jeng, Chen-Hua Yu +1 more | 2011-03-15 |