Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8072076 | Bond pad structures and integrated circuit chip having the same | Shih-Hsun Hsu, Shang-Yun Hou, Hsien-Wei Chen | 2011-12-06 |
SJ
Shih-Puu Jeng
Overall (2011): #167,874 of 364,097Top 50%
1
Patents 2011