Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8072076 | Bond pad structures and integrated circuit chip having the same | Shih-Puu Jeng, Shang-Yun Hou, Hsien-Wei Chen | 2011-12-06 |
| 7884473 | Method and structure for increased wire bond density in packages for semiconductor chips | Hsien-Wei Chen | 2011-02-08 |