CY

Chen-Hua Yu

TSMC: 41 patents #1 of 830Top 1%
📍 Hsinchu, TW: #1 of 3 inventorsTop 35%
Overall (2011): #121 of 364,097Top 1%
41
Patents 2011

Issued Patents 2011

Showing 26–41 of 41 patents

Patent #TitleCo-InventorsDate
7918251 Substrate carrier and facility interface and apparatus including same Yi-Li Hsiao 2011-04-05
7910994 System and method for source/drain contact processing Cheng-Hung Chang, Chen-Nan Yeh, Yu-Rung Hsu 2011-03-22
7910467 Method for treating layers of a gate stack Yu-Rung Hsu, Liang-Gi Yao 2011-03-22
7906836 Heat spreader structures in scribe lines Hsien-Wei Chen, Yu-Wen Liu, Jyh-Cherng Sheu, Hao-Yi Tsai, Shin-Puu Jeng +1 more 2011-03-15
7902035 Semiconductor device having multiple fin heights Chen-Nan Yeh, Yu-Rung Hsu 2011-03-08
7897514 Semiconductor contact barrier Chung-Shi Liu 2011-03-01
7897481 High throughput die-to-wafer bonding using pre-alignment Wen-Chih Chiou, Weng-Jin Wu 2011-03-01
7892909 Polysilicon gate formation by in-situ doping Ding-Yuan Chen, Chu-Yun Fu, Liang-Gi Yao, Chen-Nan Yeh 2011-02-22
7892961 Methods for forming MOS devices with metal-inserted polysilicon gate stack Cheng-Tung Lin, Liang-Gi Yao 2011-02-22
7891536 PVD target with end of service life detection capability Yi-Li Hsiao, Jean Wang, Lawrance Sheu 2011-02-22
7879711 Stacked structures and methods of fabricating stacked structures Wen-Chih Chiou, Weng-Jin Wu, Jean Wang 2011-02-01
7880303 Stacked contact with low aspect ratio Chen-Nan Yeh, Chih-Hsiang Yao, Wen-Kai Wan, Jye-Yen Cheng 2011-02-01
7875534 Realizing N-face III-nitride semiconductors by nitridation treatment Chia-Lin Yu, Ding-Yuan Chen, Wen-Chih Chiou 2011-01-25
7871923 Self-aligned air-gap in interconnect structures Chung-Shi Liu 2011-01-18
7872357 Protection for bonding pads and methods of formation Wen-Chih Chiou, Weng-Jin Wu 2011-01-18
7871922 Methods for forming interconnect structures that include forming air gaps between conductive structures Chung-Shi Liu 2011-01-18