Issued Patents 2011
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8053357 | Prevention of post CMP defects in CU/FSG process | Shau-Lin Shue | 2011-11-08 |
| 8048717 | Method and system for bonding 3D semiconductor devices | Chen-Hua Yu, Yuh-Jier Mii, Yuan-Chen Sun | 2011-11-01 |
| 7897514 | Semiconductor contact barrier | Chen-Hua Yu | 2011-03-01 |
| 7871922 | Methods for forming interconnect structures that include forming air gaps between conductive structures | Chen-Hua Yu | 2011-01-18 |
| 7871923 | Self-aligned air-gap in interconnect structures | Chen-Hua Yu | 2011-01-18 |