Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8048717 | Method and system for bonding 3D semiconductor devices | Chung-Shi Liu, Chen-Hua Yu, Yuh-Jier Mii | 2011-11-01 |
YS
Yuan-Chen Sun
Overall (2011): #118,622 of 364,097Top 35%
1
Patents 2011