Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8048717 | Method and system for bonding 3D semiconductor devices | Chung-Shi Liu, Chen-Hua Yu, Yuan-Chen Sun | 2011-11-01 |
| 7880494 | Accurate capacitance measurement for ultra large scale integrated circuits | Yih-Yuh Doong, Keh-Jeng Chang, Sally Liu, Lien Jung Hung, Victor Chih Yuan Chang | 2011-02-01 |