Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8053894 | Surface treatment of metal interconnect lines | Yih-Hsiung Lin, Ming-Ta Lei, Baw-Ching Perng, Cheng-Chung Lin, Chia-Hui Lin +1 more | 2011-11-08 |
| 7880303 | Stacked contact with low aspect ratio | Chen-Hua Yu, Chen-Nan Yeh, Chih-Hsiang Yao, Jye-Yen Cheng | 2011-02-01 |