Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8053894 | Surface treatment of metal interconnect lines | Wen-Kai Wan, Yih-Hsiung Lin, Ming-Ta Lei, Baw-Ching Perng, Cheng-Chung Lin +1 more | 2011-11-08 |
| 8021992 | High aspect ratio gap fill application using high density plasma chemical vapor deposition | Joung-Wei Liou, Tsang-Yu Liu, Chien-Feng Lin, Cheng-Liang Chang, Ming-Te Chen +3 more | 2011-09-20 |