Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8053894 | Surface treatment of metal interconnect lines | Wen-Kai Wan, Yih-Hsiung Lin, Baw-Ching Perng, Cheng-Chung Lin, Chia-Hui Lin +1 more | 2011-11-08 |
| 7902679 | Structure and manufacturing method of a chip scale package with low fabrication cost, fine pitch and high reliability solder bump | Mou-Shiung Lin, Chuen-Jye Lin | 2011-03-08 |