Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8021992 | High aspect ratio gap fill application using high density plasma chemical vapor deposition | Joung-Wei Liou, Chien-Feng Lin, Cheng-Liang Chang, Ming-Te Chen, Chia-Hui Lin +3 more | 2011-09-20 |