Issued Patents 2011
Showing 26–32 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7902644 | Integrated circuit package system for electromagnetic isolation | Rui Huang, Byung Tai Do, Seng Guan Chow | 2011-03-08 |
| 7902638 | Semiconductor die with through-hole via on saw streets and through-hole via in active area of die | Byung Tai Do, Linda Pei Ee Chua | 2011-03-08 |
| 7892894 | Method of manufacturing integrated circuit package system with warp-free chip | Byung Tai Do, Il Kwon Shim, Antonio B. Dimaano, Jr. | 2011-02-22 |
| 7888184 | Integrated circuit packaging system with embedded circuitry and post, and method of manufacture thereof | Il Kwon Shim, Seng Guan Chow, Seung Uk Yoon, Jong-Woo Ha | 2011-02-15 |
| 7872345 | Integrated circuit package system with rigid locking lead | Seng Guan Chow, Linda Pei Ee Chua | 2011-01-18 |
| 7868434 | Integrated circuit package-on-package stacking system | Dioscoro A. Merilo, You Yang Ong, Seng Guan Chow, Ma. Shirley Asoy | 2011-01-11 |
| 7863109 | Integrated circuit packaging system with a protrusion on an inner stacking module and method of manufacture thereof | Seng Guan Chow, Rui Huang | 2011-01-04 |