Issued Patents 2011
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8084866 | Microelectronic devices and methods for filling vias in microelectronic devices | William M. Hiatt | 2011-12-27 |
| 8084854 | Pass-through 3D interconnect for microelectronic dies and associated systems and methods | David S. Pratt, Dewali Ray | 2011-12-27 |
| 8053857 | Packaged microelectronic imagers and methods of packaging microelectronic imagers | Salman Akram, Charles M. Watkins, Alan G. Wood, William M. Hiatt | 2011-11-08 |
| 8035179 | Packaged microelectronic imagers and methods of packaging microelectronic imagers | Salman Akram, William M. Hiatt | 2011-10-11 |
| 8030780 | Semiconductor substrates with unitary vias and via terminals, and associated systems and methods | Kunal R. Parekh | 2011-10-04 |
| 8017982 | Imagers with contact plugs extending through the substrates thereof and imager fabrication methods | Steve Oliver | 2011-09-13 |
| 7993944 | Microelectronic imagers with optical devices having integral reference features and methods for manufacturing such microelectronic imagers | Steven Oliver, James M. Wark | 2011-08-09 |
| 7989022 | Methods of processing substrates, electrostatic carriers for retaining substrates for processing, and assemblies comprising electrostatic carriers having substrates electrostatically bonded thereto | Dewali Ray, Warren M. Farnworth | 2011-08-02 |
| 7968460 | Semiconductor with through-substrate interconnect | Kunal R. Parekh | 2011-06-28 |
| 7960829 | Support structure for use in thinning semiconductor substrates and for supporting thinned semiconductor substrates | Alan G. Wood, Warren M. Farnworth, David R. Hembree, Sidney B. Rigg, William M. Hiatt +2 more | 2011-06-14 |
| 7956443 | Through-wafer interconnects for photoimager and memory wafers | Salman Akram, Charles M. Watkins, Mark Hiatt, David R. Hembree, James M. Wark +6 more | 2011-06-07 |
| 7955946 | Methods of determining x-y spatial orientation of a semiconductor substrate comprising an integrated circuit, methods of positioning a semiconductor substrate comprising an integrated circuit, methods of processing a semiconductor substrate, and semiconductor devices | Dave Pratt, Steve Oliver, Mark Hiatt | 2011-06-07 |
| 7931769 | Method of forming temporary carrier structure and associated release techniques | — | 2011-04-26 |
| 7918383 | Methods for placing substrates in contact with molten solder | Salman Akram, Daniel P. Cram, Roy Lange, Warren M. Farnworth | 2011-04-05 |
| 7919348 | Methods for protecting imaging elements of photoimagers during back side processing | Salman Akram | 2011-04-05 |
| 7915736 | Microfeature workpieces and methods for forming interconnects in microfeature workpieces | William M. Hiatt, Richard L. Stocks | 2011-03-29 |
| 7892972 | Methods for fabricating and filling conductive vias and conductive vias so formed | Salman Akram, William M. Hiatt, Steve Oliver, Alan G. Wood, Sidney B. Rigg +1 more | 2011-02-22 |