Issued Patents 2011
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8053279 | Methods and systems for imaging and cutting semiconductor wafers and other semiconductor workpieces | Tom A. Muntifering, Paul J. Clawson | 2011-11-08 |
| 7989022 | Methods of processing substrates, electrostatic carriers for retaining substrates for processing, and assemblies comprising electrostatic carriers having substrates electrostatically bonded thereto | Dewali Ray, Kyle K. Kirby | 2011-08-02 |
| 7964971 | Flexible column die interconnects and structures including same | — | 2011-06-21 |
| 7960829 | Support structure for use in thinning semiconductor substrates and for supporting thinned semiconductor substrates | Alan G. Wood, David R. Hembree, Sidney B. Rigg, William M. Hiatt, Peter Benson +2 more | 2011-06-14 |
| 7956443 | Through-wafer interconnects for photoimager and memory wafers | Salman Akram, Charles M. Watkins, Mark Hiatt, David R. Hembree, James M. Wark +6 more | 2011-06-07 |
| 7932179 | Method for fabricating semiconductor device having backside redistribution layers | Steve Oliver | 2011-04-26 |
| 7923298 | Imager die package and methods of packaging an imager die on a temporary carrier | Steven Oliver | 2011-04-12 |
| 7918383 | Methods for placing substrates in contact with molten solder | Kyle K. Kirby, Salman Akram, Daniel P. Cram, Roy Lange | 2011-04-05 |
| 7880307 | Semiconductor device including through-wafer interconnect structure | Alan G. Wood | 2011-02-01 |
| 7875529 | Semiconductor devices | Leonard Forbes, Paul A. Farrar, Arup Bhattacharyya, Hussein I. Hanafi | 2011-01-25 |
| 7871859 | Vertical surface mount assembly and methods | Larry D. Kinsman, Jerry M. Brooks, Walter L. Moden, Terry R. Lee | 2011-01-18 |
| 7872332 | Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods | Owen R. Fay, David R. Hembree | 2011-01-18 |