Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7994547 | Semiconductor devices and assemblies including back side redistribution layers in association with through wafer interconnects | Salman Akram | 2011-08-09 |
| 7960829 | Support structure for use in thinning semiconductor substrates and for supporting thinned semiconductor substrates | Alan G. Wood, Warren M. Farnworth, David R. Hembree, Sidney B. Rigg, William M. Hiatt +2 more | 2011-06-14 |