Issued Patents 2011
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8062958 | Microelectronic device wafers and methods of manufacturing | Ed A. Schrock, Ford B. Grigg | 2011-11-22 |
| 8053857 | Packaged microelectronic imagers and methods of packaging microelectronic imagers | Salman Akram, Charles M. Watkins, Kyle K. Kirby, William M. Hiatt | 2011-11-08 |
| 7960829 | Support structure for use in thinning semiconductor substrates and for supporting thinned semiconductor substrates | Warren M. Farnworth, David R. Hembree, Sidney B. Rigg, William M. Hiatt, Peter Benson +2 more | 2011-06-14 |
| 7956443 | Through-wafer interconnects for photoimager and memory wafers | Salman Akram, Charles M. Watkins, Mark Hiatt, David R. Hembree, James M. Wark +6 more | 2011-06-07 |
| 7951702 | Methods for fabricating semiconductor components with conductive interconnects having planar surfaces | William M. Hiatt, David R. Hembree | 2011-05-31 |
| 7935991 | Semiconductor components with conductive interconnects | William M. Hiatt, David R. Hembree | 2011-05-03 |
| 7892972 | Methods for fabricating and filling conductive vias and conductive vias so formed | Salman Akram, William M. Hiatt, Steve Oliver, Sidney B. Rigg, James M. Wark +1 more | 2011-02-22 |
| 7883908 | Method for fabricating semiconductor component having encapsulated through wire interconnect (TWI) | David R. Hembree | 2011-02-08 |
| 7880307 | Semiconductor device including through-wafer interconnect structure | Warren M. Farnworth | 2011-02-01 |