Issued Patents 2011
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8084866 | Microelectronic devices and methods for filling vias in microelectronic devices | Kyle K. Kirby | 2011-12-27 |
| 8053857 | Packaged microelectronic imagers and methods of packaging microelectronic imagers | Salman Akram, Charles M. Watkins, Kyle K. Kirby, Alan G. Wood | 2011-11-08 |
| 8035179 | Packaged microelectronic imagers and methods of packaging microelectronic imagers | Kyle K. Kirby, Salman Akram | 2011-10-11 |
| 7960829 | Support structure for use in thinning semiconductor substrates and for supporting thinned semiconductor substrates | Alan G. Wood, Warren M. Farnworth, David R. Hembree, Sidney B. Rigg, Peter Benson +2 more | 2011-06-14 |
| 7951702 | Methods for fabricating semiconductor components with conductive interconnects having planar surfaces | Alan G. Wood, David R. Hembree | 2011-05-31 |
| 7935991 | Semiconductor components with conductive interconnects | Alan G. Wood, David R. Hembree | 2011-05-03 |
| 7915736 | Microfeature workpieces and methods for forming interconnects in microfeature workpieces | Kyle K. Kirby, Richard L. Stocks | 2011-03-29 |
| 7892972 | Methods for fabricating and filling conductive vias and conductive vias so formed | Salman Akram, Steve Oliver, Alan G. Wood, Sidney B. Rigg, James M. Wark +1 more | 2011-02-22 |
| 7863187 | Microfeature workpieces and methods for forming interconnects in microfeature workpieces | Ross S. Dando | 2011-01-04 |