Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7989345 | Methods of forming blind wafer interconnects, and related structures and assemblies | Salman Akram | 2011-08-02 |
| 7960829 | Support structure for use in thinning semiconductor substrates and for supporting thinned semiconductor substrates | Alan G. Wood, Warren M. Farnworth, David R. Hembree, William M. Hiatt, Peter Benson +2 more | 2011-06-14 |
| 7956443 | Through-wafer interconnects for photoimager and memory wafers | Salman Akram, Charles M. Watkins, Mark Hiatt, David R. Hembree, James M. Wark +6 more | 2011-06-07 |
| 7892972 | Methods for fabricating and filling conductive vias and conductive vias so formed | Salman Akram, William M. Hiatt, Steve Oliver, Alan G. Wood, James M. Wark +1 more | 2011-02-22 |