Issued Patents 2011
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8053909 | Semiconductor component having through wire interconnect with compressed bump | — | 2011-11-08 |
| 7960829 | Support structure for use in thinning semiconductor substrates and for supporting thinned semiconductor substrates | Alan G. Wood, Warren M. Farnworth, Sidney B. Rigg, William M. Hiatt, Peter Benson +2 more | 2011-06-14 |
| 7956443 | Through-wafer interconnects for photoimager and memory wafers | Salman Akram, Charles M. Watkins, Mark Hiatt, James M. Wark, Warren M. Farnworth +6 more | 2011-06-07 |
| 7951702 | Methods for fabricating semiconductor components with conductive interconnects having planar surfaces | Alan G. Wood, William M. Hiatt | 2011-05-31 |
| 7935991 | Semiconductor components with conductive interconnects | Alan G. Wood, William M. Hiatt | 2011-05-03 |
| 7919846 | Stacked semiconductor component having through wire interconnect | — | 2011-04-05 |
| 7916396 | Lens master devices, lens structures, imaging devices, and methods and apparatuses of making the same | Steve Oliver | 2011-03-29 |
| 7883908 | Method for fabricating semiconductor component having encapsulated through wire interconnect (TWI) | Alan G. Wood | 2011-02-08 |
| 7872332 | Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods | Owen R. Fay, Warren M. Farnworth | 2011-01-18 |