Issued Patents 2011
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8053857 | Packaged microelectronic imagers and methods of packaging microelectronic imagers | Charles M. Watkins, Kyle K. Kirby, Alan G. Wood, William M. Hiatt | 2011-11-08 |
| 8035179 | Packaged microelectronic imagers and methods of packaging microelectronic imagers | Kyle K. Kirby, William M. Hiatt | 2011-10-11 |
| 7994547 | Semiconductor devices and assemblies including back side redistribution layers in association with through wafer interconnects | Peter Benson | 2011-08-09 |
| 7994595 | Strained semiconductor by full wafer bonding | Leonard Forbes, Joseph E. Geusic | 2011-08-09 |
| 7989311 | Strained semiconductor by full wafer bonding | Leonard Forbes, Joseph E. Geusic | 2011-08-02 |
| 7989345 | Methods of forming blind wafer interconnects, and related structures and assemblies | Sidney B. Rigg | 2011-08-02 |
| 7960829 | Support structure for use in thinning semiconductor substrates and for supporting thinned semiconductor substrates | Alan G. Wood, Warren M. Farnworth, David R. Hembree, Sidney B. Rigg, William M. Hiatt +2 more | 2011-06-14 |
| 7956443 | Through-wafer interconnects for photoimager and memory wafers | Charles M. Watkins, Mark Hiatt, David R. Hembree, James M. Wark, Warren M. Farnworth +6 more | 2011-06-07 |
| 7952158 | Elevated pocket pixels, imaging devices and systems including the same and method of forming the same | — | 2011-05-31 |
| 7918383 | Methods for placing substrates in contact with molten solder | Kyle K. Kirby, Daniel P. Cram, Roy Lange, Warren M. Farnworth | 2011-04-05 |
| 7919348 | Methods for protecting imaging elements of photoimagers during back side processing | Kyle K. Kirby | 2011-04-05 |
| 7892972 | Methods for fabricating and filling conductive vias and conductive vias so formed | William M. Hiatt, Steve Oliver, Alan G. Wood, Sidney B. Rigg, James M. Wark +1 more | 2011-02-22 |