Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8084854 | Pass-through 3D interconnect for microelectronic dies and associated systems and methods | David S. Pratt, Kyle K. Kirby | 2011-12-27 |
| 7989022 | Methods of processing substrates, electrostatic carriers for retaining substrates for processing, and assemblies comprising electrostatic carriers having substrates electrostatically bonded thereto | Warren M. Farnworth, Kyle K. Kirby | 2011-08-02 |