Issued Patents 2011
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8084854 | Pass-through 3D interconnect for microelectronic dies and associated systems and methods | Kyle K. Kirby, Dewali Ray | 2011-12-27 |
| 8021981 | Redistribution layers for microfeature workpieces, and associated systems and methods | — | 2011-09-20 |
| 7951709 | Method and apparatus providing integrated circuit having redistribution layer with recessed connectors | — | 2011-05-31 |
| 7952170 | System including semiconductor components having through interconnects and back side redistribution conductors | — | 2011-05-31 |
| 7886267 | Multiple-developer architecture for facilitating the localization of software applications | David I. Stones, Adam Friedman, Clinton De Young, Stephen John Gibbon, Edwin Ho +1 more | 2011-02-08 |