Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8034702 | Methods of forming through substrate interconnects | Andy Perkins | 2011-10-11 |
| 7955946 | Methods of determining x-y spatial orientation of a semiconductor substrate comprising an integrated circuit, methods of positioning a semiconductor substrate comprising an integrated circuit, methods of processing a semiconductor substrate, and semiconductor devices | Kyle K. Kirby, Steve Oliver, Mark Hiatt | 2011-06-07 |
| 7952171 | Die stacking with an annular via having a recessed socket | — | 2011-05-31 |