Issued Patents 2011
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8084105 | Method of depositing boron nitride and boron nitride-derived materials | Jeong-Uk Huh, Mihaela Balseanu, Victor Nguyen, Derek R. Witty, Hichem M'Saad | 2011-12-27 |
| 7964442 | Methods to obtain low k dielectric barrier with superior etch resistivity | Huiwen Xu, Yijun Liu, Derek R. Witty, Hichem M'Saad | 2011-06-21 |
| 7960294 | Method of modifying interlayer adhesion | Francimar Schmitt, Son V. Nguyen, Shankar Venkataraman | 2011-06-14 |
| 7951730 | Decreasing the etch rate of silicon nitride by carbon addition | Ritwik Bhatia, Chad Peterson, Hichem M'Saad | 2011-05-31 |
| 7923386 | Method to improve the step coverage and pattern loading for dielectric films | Mihaela Balseanu, Mei-Yee Shek, Hichem M'Saad | 2011-04-12 |
| 7910491 | Gapfill improvement with low etch rate dielectric liners | Young Soo Kwon, Bi Jang, Anchuan Wang, Young S. Lee, Mihaela Balseanu +1 more | 2011-03-22 |
| 7879683 | Methods and apparatus of creating airgap in dielectric layers for the reduction of RC delay | Amir Al-Bayati, Alexandros T. Demos, Kang Sub Yim, Mehul Naik, Zhenjiang Cui +2 more | 2011-02-01 |
| 7871926 | Methods and systems for forming at least one dielectric layer | Mihaela Balseanu, Victor Nguyen, Derek R. Witty, Hichem M'Saad, Haichun Yang +3 more | 2011-01-18 |