Issued Patents 2004
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6808590 | Method and apparatus of arrayed sensors for metrological control | Rodney Kistler, Aleksander Owczarz, David Hemker, Nicolas Bright | 2004-10-26 |
| 6808442 | Apparatus for removal/remaining thickness profile manipulation | David Wei, Aleksander Owczarz, John M. Boyd, Rod Kistler | 2004-10-26 |
| 6788050 | System, method and apparatus for thin-film substrate signal separation using eddy current | — | 2004-09-07 |
| 6767428 | Method and apparatus for chemical mechanical planarization | Aleksandar Owczarz, Rod Kistler | 2004-07-27 |
| 6749491 | CMP belt stretch compensation apparatus and methods for using the same | David Wei, Aleksander Owzarz | 2004-06-15 |
| 6729943 | System and method for controlled polishing and planarization of semiconductor wafers | Rod Kistler | 2004-05-04 |
| 6726530 | End-point detection system for chemical mechanical polishing applications | Katrina Mikhaylich, Mike Ravkin | 2004-04-27 |
| 6719874 | Active retaining ring support | Aleksander Owczarz, Miguel Saldana, David Wei, Damon Vincent Williams | 2004-04-13 |
| 6716299 | Profiled retaining ring for chemical mechanical planarization | Aleksander Owczarz, Jeffrey Yung | 2004-04-06 |
| 6705930 | System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques | John M. Boyd, Rod Kistler | 2004-03-16 |
| 6676493 | Integrated planarization and clean wafer processing system | Aleksandar Owczarz | 2004-01-13 |